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1. general description the nx3p191 is a high-side load switch whic h features a low on resistance p-channel mosfet with input inrush current reduction that supports more than 500 ma of continuous current and an integrated output di scharge resistor to discharge the output capacitance when disabled. designed for operation from 1.1 v to 3.6 v, it is used in power domain isolation applications to reduce power dissipation and extend battery life. the enable logic includes integrated logic level translation making the device compatible with lower voltage processors and controllers. the nx3p191 is ideal for portable, battery operated applications due to low ground current and ultra-low shutdown current. 2. features and benefits ? wide supply voltage range from 1.1 v to 3.6 v ? very low on resistance: ? 95 m ? (typical) at a supply voltage of 1.8 v ? high noise immunity ? low-power mode wh en en is low ? low ground current (2 ? a maximum) ? 1.2 v control logic at a supply voltage of 3.6 v ? high current handling capability (500 ma continuous current) ? internal output discharge resistor ? turn-on slew rate limiting ? esd protection: ? hbm jesd22-a114f class 3a exceeds 4000 v ? cdm aec-q100-011 revision b exceeds 500 v ? specified from ? 40 ? c to +85 ? c 3. applications ? cell phone ? digital cameras and audio devices ? portable and battery-powered equipment nx3p191 logic controlled hig h-side power switch rev. 2 ? 4 november 2011 product data sheet
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 2 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 4. ordering information 5. marking 6. functional diagram 7. pinning information 7.1 pinning table 1. ordering information type number package temperature range name description version NX3P191UK ? 40 ? c to +85 ? c wlcsp4 wafer level chip-size package; 4 bumps; body 0.76 ? 0.76 ? 0.51 mm. (backside coating included) nx3p190/nx3p191 table 2. marking codes type number marking code NX3P191UK x1 fig 1. logic symbol fig 2. logic diagram (simplified schematic) 001aao342 en vin vout aaa-000036 level shift, slew rate control and load discharge en r pd r dch vin vout fig 3. pin configuration for wlcsp4 fig 4. ball mapping for wlcsp4 bump a1 index area 12 a b aaa-000037 transparent top view nx3p191 12 vin vout en gnd a b 001aao345 transparent top view
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 3 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 7.2 pin description 8. functional description [1] h = high voltage level; l = low voltage level. 9. limiting values [1] the minimum input voltage rating may be exceeded if the input current rating is observed. [2] the minimum and maximum switch voltage ratings may be e xceeded if the switch clamping current rating is observed. [3] the (absolute) maximum power dissipa tion depends on the junction temperature t j. higher power dissipation is allowed in conjunction with lower ambient temperatures. the conditi ons to determine the specified values are t amb = 85 c and the use of a two layer pcb. table 3. pin description symbol pin description vin a1 input voltage en b1 enable input (active high) vout a2 output voltage gnd b2 ground (0 v) table 4. function table [1] input en switch l switch off h switch on table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v i input voltage input en [1] ? 0.5 +4.0 v input vin [2] ? 0.5 +4.0 v v sw switch voltage output vout [2] ? 0.5 v i(vin) v i ik input clamping current input en: v i(en) < ? 0.5 v ? 50 - ma i sk switch clamping cu rrent input vin: v i(vin) < ? 0.5 v ? 50 - ma output vout: v o(vout) < ? 0.5 v ? 50 - ma output vout: v o(vout) >v i(vin) ?? 0.5 v - 50 ma i sw switch current v sw > ? 0.5 v t amb = 25 c - ? 1000 ma t amb = 85 c - ? 500 ma t j(max) maximum junction temperature ? 40 +125 ?c t stg storage temperature ? 65 +150 ?c p tot total power dissipation [3] -300mw
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 4 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 10. recommended operating conditions 11. thermal characteristics [1] the overall rth(j-a) can vary depending on the board layout. to minimize the effective rth(j-a), all pins must have a solid connection to larger cu layer areas e.g. to the power and ground layer. in multi-layer pcb applications, the second layer should be used to c reate a large heat spreader area right below the device. if this layer is either ground or power, it should be connected with several v ias to the top layer connecting to the device ground or supply.try not to use any solder-stop varnish under the chip. [2] please rely on the measurement data given for a rough estimation of the rth(j-a) in your application. the actual rth(j-a) value may vary in applications using differ ent layer stacks and layouts 12. static characteristics table 6. recommended operating conditions symbol parameter conditions min max unit v i input voltage 1.1 3.6 v t amb ambient temperature ? 40 +85 ?c table 7. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient [1] [2] 130 k/w table 8. static characteristics v i(vin) = v i(en) , unless otherwise specified; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions t amb = 25 ?c t amb = ? 40 ? c to +85 ?c unit min typ max min max v ih high-level input voltage en input v i(vin) = 1.1 v to 1.3 v - - - 1.0 - v v i(vin) = 1.3 v to 1.8 v - - - 1.2 - v v i(vin) = 1.8 v to 3.6 v - - - 1.2 - v v il low-level input voltage en input v i(vin) = 1.1 v to 1.3 v - - - - 0.3 v v i(vin) = 1.3 v to 1.8 v - - - - 0.4 v v i(vin) = 1.8 v to 3.6 v - - - - 0.45 v r pd pull-down resistance en input - 4 - - - m ? i gnd ground current v i(vin) = 3.6 v; vout open; see figure 5 and figure 6 --- ? 2- ? a i off power-off leakage current v i(vin) =3.6v; v i(en) =gnd; v o(vout) = gnd; see figure 8 -0.1- - 2 ? a r dch discharge resistance vout output - 280 - - - ?
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 5 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 12.1 graphs v i(vin) = 1.8 v; v i(en) = 1.8 v; i load = 500 ma. v i(en) = v i(vin) ; t amb = 25 ? c; i load = 500ma. fig 5. waveform showing the ground current versus temperature fig 6. waveform showing the ground current versus input voltage on pin vin t amb (c) -40 110 80 20 50 -10 001aao346 0.9 i gnd (a) 0.7 0.5 0.3 0.2 0.4 0.6 0.8 v i(vin) (v) 1.2 3.2 3.2 2.2 2.7 1.7 001aao347 0.6 0.4 0.8 1.0 i gnd (a) 0.2 fig 7. waveform showing the additional ground current versus input voltage v i(en) (v) 04 3 12 001aao348 4 8 12 i gnd (a) 0 v i(vin) = 3.6 v v i(vin) = 1.8 v
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 6 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 12.2 on resistance v i(en) = gnd. (1) v i(vin) = 3.6 v. (2) v i(vin) = 2.5 v. (3) v i(vin) = 1.8 v. (4) v i(vin) = 1.2 v. fig 8. waveforms showing the power-off leakage current versus temperature 001aao349 0.7 i off (a) 0 0.1 0.2 0.3 0.4 0.5 0.6 t amb (c) -40 0 40 80 100 60 20 -20 (1) (2) (3) (4) table 9. on resistance at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v) symbol parameter conditions t amb = 25 ?c unit min typ max r on on resistance v i(en) =1.5v; i load =200ma; see figure 9 , figure 10 and figure 11 v i(vin) =1.2v - 150 - m ? v i(vin) =1.5v - 110 - m ? v i(vin) = 1.8 v - 95 130 m ? v i(vin) =2.5v - 75 - m ? v i(vin) =3.6v - 65 - m ?
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 7 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 12.3 on resistance test circuit and waveforms r on = v sw / i load . fig 9. test circuit for measuring on resistance 001aao350 en v ih vin vout gnd i load v i v sw i load = 100 ma. (1) v i(vin) = 1.2 v. (2) v i(vin) = 1.8 v. (3) v i(vin) = 3.6 v. v i(en) = v i(vin) ; t amb = 25 ? c. (1) i load = 10 ma. (2) i load = 100 ma. (3) i load = 250 ma. (4) i load = 350 ma. (5) i load = 500 ma. fig 10. waveform showing the on resistance versus temperature fig 11. waveform showing the on resistance versus input voltage tamb (c) -40 110 80 20 50 -10 001aao351 120 80 160 200 r on (m) 40 (1) (2) (3) 001aao352 v i(vin) (v) 1.2 3.6 2.8 2.0 120 80 160 200 r on (m) 40 (1) (2) (3) (4) (5)
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 8 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 13. dynamic characteristics [1] t en is the same as t pzh . 13.1 waveform and test circuits table 10. dynamic characteristics at recommended operating conditions; voltages are re ferenced to gnd (ground = 0 v); for test circuit see figure 13 . symbol parameter conditions t amb = 25 ?c unit min typ max t en enable time en to vout; see figure 12 [1] v i(vin) =1.8v - 80 - ? s v i(vin) =3.6v - 40 - ? s measurement points are given in table 11 . logic level: v oh is the typical output voltage that occurs with the output load. fig 12. switching times 001aao353 en input vout output t phz v i gnd v m v x v y v oh gnd t pzh table 11. measurement points supply voltage en input output v i(vin) v m v x v y 1.1 v to 3.6 v 0.5 ? v i(en) 0.1 ? v oh 0.9 ? v oh
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 9 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch test data is given in table 12 . definitions test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. v ext = external voltage for measuring switching times. fig 13. test circuit for measuring switching times 001aao354 en vout vin v i i load v ext g c l table 12. test data supply voltage input load v ext v i(en) c l i load 1.1 v to 3.6 v 1.5 v 1 ? f 200 ma v i(vin) = 1.8 v; v i(en) = 1.8 v; c l = 1 ? f; i load = 200 ma. v i(vin) = 3.6 v; v i(en) = 1.8 v; c l = 1.0 ? f; i load =200ma. fig 14. waveform showing the enable time versus inrush current fig 15. waveform showing the enable time versus inrush current aaa-000038 aaa-000039
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 10 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch v i(vin) = 1.8 v; v i(en) = 1.8 v. v i(vin) = 3.6 v; v i(en) = 3.6 v. fig 16. waveform showing the disable time fig 17. waveform showing the disable time aaa-000040 aaa-000041
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 11 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 14. package outline fig 18. package outline wlcsp4 (nx3p190/nx3p191) references outline version european projection issue date iec jedec jeita nx3p190/nx3p191 nx3p190_191_po 11-05-24 11-06-09 unit mm max nom min 0.54 0.22 0.29 0.81 0.81 0.025 0.03 a dimensions wlcsp4: wafer level chip-size package. 4 bumps; body 0.76 x 0.76 x 0.51 mm. (backside coating included) nx3p190/nx3p191 a 1 a 2 0.32 0.51 0.20 0.26 0.76 0.76 0.40 0.31 bdee v 0.025 0.48 0.18 0.23 0.71 0.71 0.30 wy 0 2 mm scale detail x ball a1 index area a b c y x d e e e ball a1 index area b ac b v cw 12 b a a a 2 a 1
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 12 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 15. abbreviations 16. revision history table 13. abbreviations acronym description mosfet metal-oxide semiconductor field effect transistor table 14. revision history document id release date data sheet status change notice supersedes nx3p191 v.2 20111104 product data sheet - nx3p191 v.1 modifications: ? legal pages updated. nx3p191 v.1 20110831 product data sheet - -
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 13 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch 17. legal information 17.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 17.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 17.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
nx3p191 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 4 november 2011 14 of 15 nxp semiconductors nx3p191 logic controlled high-side power switch non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 17.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 18. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors nx3p191 logic controlled high-side power switch ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 4 november 2011 document identifier: nx3p191 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 functional description . . . . . . . . . . . . . . . . . . . 3 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 10 recommended operating conditions. . . . . . . . 4 11 thermal characteristics . . . . . . . . . . . . . . . . . . 4 12 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 12.1 graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 12.2 on resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12.3 on resistance test circuit and waveforms . . . . 7 13 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 13.1 waveform and test circuits . . . . . . . . . . . . . . . . 8 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 15 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 16 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 17 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 17.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 17.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 17.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 17.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 18 contact information. . . . . . . . . . . . . . . . . . . . . 14 19 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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